JPS6234456Y2 - - Google Patents

Info

Publication number
JPS6234456Y2
JPS6234456Y2 JP1980026159U JP2615980U JPS6234456Y2 JP S6234456 Y2 JPS6234456 Y2 JP S6234456Y2 JP 1980026159 U JP1980026159 U JP 1980026159U JP 2615980 U JP2615980 U JP 2615980U JP S6234456 Y2 JPS6234456 Y2 JP S6234456Y2
Authority
JP
Japan
Prior art keywords
photoelectric conversion
optical fiber
conversion element
introduction hole
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980026159U
Other languages
English (en)
Japanese (ja)
Other versions
JPS56129759U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980026159U priority Critical patent/JPS6234456Y2/ja
Publication of JPS56129759U publication Critical patent/JPS56129759U/ja
Application granted granted Critical
Publication of JPS6234456Y2 publication Critical patent/JPS6234456Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
JP1980026159U 1980-03-03 1980-03-03 Expired JPS6234456Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980026159U JPS6234456Y2 (en]) 1980-03-03 1980-03-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980026159U JPS6234456Y2 (en]) 1980-03-03 1980-03-03

Publications (2)

Publication Number Publication Date
JPS56129759U JPS56129759U (en]) 1981-10-02
JPS6234456Y2 true JPS6234456Y2 (en]) 1987-09-02

Family

ID=29622165

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980026159U Expired JPS6234456Y2 (en]) 1980-03-03 1980-03-03

Country Status (1)

Country Link
JP (1) JPS6234456Y2 (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014196263A1 (ja) * 2013-06-07 2014-12-11 株式会社村田製作所 光部品、光プラグ、光コネクタ及び光部品の製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4144541A (en) * 1977-01-27 1979-03-13 Electric Power Research Institute, Inc. Light-activated semiconductor device package unit
JPS626705Y2 (en]) * 1979-07-25 1987-02-16

Also Published As

Publication number Publication date
JPS56129759U (en]) 1981-10-02

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